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Buttini, F., Colombo, P., Wenger, M.P.E., Mesquida,P., Marriott, C., Jones, S.A. 'Back to Basics: The development of a simple, homogenous, two-component dry powder inhaler formulation for the delivery of budesonide using miscible vinyl polymers',J. Pharm. Sci. 97 (3), pp1257-1267

Clode, M.P.'Life Cycle Assessment & Eco-Audit of Aluminium Extrusions', ALEX2007, Eindhoven NL, 12th to 14th November 2007

Jansens, K., Raabe, D., Nestler B., Kosezchnik, E., Miodownik M. A. Computational Materials Engineering, Elsevier, ISBN-10: 012369468X, 2007.

Conreen, M., Laughlin, Z. and Miodownik, M. A. 'Strange Material', Proceedings of Ars Ornata Europeana, Manchester (2007).

Lin F., Godfrey A., Miodownik M. A., and Liu Q. 'Modeling of cube-texture evolution during grain growth in Ni thick-films based on experimental observations', Proceedings of Third Joint International Conference on Recrystal lization and Grain Growth, Jeju, Korea. pp. 347-352., (2007)

Miodownik, M. A. Developing the sensoaesthetic properties of materials, Journal of Pure and Applied Chemistry, Vol.79, No.10, pp.1635-1641, 2007

Blanco E.M., Nesbitt S.A., Horton M.A., Mesquida P. A multiprotein microarray on silicon dioxide fabricated by electric droplet lithography, Advanced Materials Vol.19 Issue 18 (2007), pp2469-2473

Chen K., Liu C., Whalley D.C., Hutt D.A., Li J.F., Mannan S.H., Clode M.P. Liquid Solder InterconnectsHITEN 2007, Oxford

Lorenz C.D. and Travesset A.Charge inversion of divalent ionic solutions in silica channels Phys. Rev. E 75, 061202 (2007)published online at scitation.aip.org

Munoz J. J., Barrett, K. and Miodownik M. A. A Deformation Gradient Decomposition Method for the Analysis of the Mechanics of Morphogenesis J. Biomechanics 40 (2007) 1372-1380. (article)

Li J.F., Mannan S.H., Clode M.P., Johnston C., Crossley A.Dissolution and Interfacial Reaction of Nb in Contact with the Molten 52In-48Sn Solder, Acta Materialia, Vol. 55,(2007) No.15 : pp5057-5071

Li J.F., Mannan S.H., Clode M.P., Whalley D.C., Hutt D.A.,Comparison of interfacial reactions of Ni and Ni-P in extended contact with liquid Sn-Bi based solders, Acta Materialia, Vol. 55,(2007) No.2 : pp737-752

Mesquida P., Riener C.K., MacPhee C.E., McKendry R.A.Morphology and Mechanical Stability of Amyloid-like Peptide Fibrils Journal of Materials Science: Materials in Medicine, 18 (7) (2007), pp1325-1331.

Wenger M.P.E., Bozec L., Horton M.A., Mesquida P.Mechanical properties of collagen fibrilsBiophysical Journal, 93 (2007) pp1255-1263.

Schlapak R., Armitage D., Saucedo-Zeni N., Latini G., Gruber H., Mesquida P., Cacialli F., Hohage M., Howorka S.Preparation and Characterisation of Dense Films of Poly(amidoamine) Dendrimers on Indium Tin Oxide Langmuir, 23 (17) (2007) pp8916-8924.

Naujoks N., Mesquida P., Stemmer A.Electrical SPM-Based Nanofabrication TechniquesChapter in "SPM: Electrical And Electromechanical Phenomena At The Nanoscale" Eds. S.Kalinin, A.Gruverman, Springer, New York, 2007, ISBN-10: 0-387-28667-5

Sarinnaphakorn L., Mesquida P., Giordano C., Sandrini E., Chiesa R., Cigada A., Fenlon M., Di Silvio L.Physicochemical Properties and Biological Response of Titanium Surface Modified by Anodic Spark Deposition for Dental Implants IFMBE Proceedings, Vol.15, Part 5, Springer, Berlin, Heidelberg, 2007, ISBN 978-3-540-68016-1.

Harun A., Holm E. A. , Clode, M. P. and Miodownik M. A. On Computer Simulation Methods to Model Zener Pinning,Acta Materialia, 54 (2006) pp3261-3273.

Lorenz, C.D. and Travesset A. Atomistic simulations of Langmuir monolayer collapse, Langmuir 22, 10016 (2006).

Mesquida P., Blanco E.M., McKendry R.A., Patterning Amyloid Peptide Fibrils by AFM Charge Writing.Langmuir, 22 (22): 9089 -9091, 2006

Leung, K., Rempe, S.B. and Lorenz, C.D., Salt permeation and exclusion in silica and graphitic pores, Physical Review Letters 96, 095504 (2006).

Hillman S. and Mannan S. H., Analysis of Jamming Networks in Sheared Suspensions, Journal of Rheology,50(3): 239-258, 2006.

Chen, K., Liu, C., Whalley, D. C., Hutt, D. A., Li, J. and Mannan, S.H., Electroless Ni-W-P Alloys as Barrier Coatings for Liquid Solder Interconnects, Proceedings of the 1st IEEE Electronic System integration Technology Conference, Dresden, Sept 5-7, 2006, Volume 1, pp 421-427, ISBN: 1-4244-0553-X.

Li J.F., Mannan S. H., Clode, M.P., Fenner, D.N., Whalley, D.C., Chen K., Reliability and Failure Analysis of Dummy IGBT Assembles Using Liquid Solder Joints Under Thermal Cycling, HITEC 2006, Santa Fe, USA, pp. 390-397, May 2006.

Li J.F., Mannan S.H., Clode M.P., Whalley D.C. and Hutt D.A., Interfacial reactions between molten Sn-Bi-X solders and Cu substrates for liquid solder interconnects, Acta Materialia, 54(11): 2907-2922, 2006.

Yan, H., Miodownik, M. A., and Randle, V. Experimental and computer model investigations of the texture evolution of a non-oriented silicon steel accepted by Journal of Material Science and Technology Feb 2006.

Li J.F., Mannan S.H. and Clode, M.P., Lifetime of solid Metals in contact with liquid solders for high-temperature liquid solder assemblies, Scripta Materialia, 54(10): 1773-1778, 2006.

Li J.F., Mannan S.H. and Clode, M.P., Edge effects in intermetallic compound crystal growth between Nb and molten 52In–48Sn solder, Applied Physics Letters, 88: 104105, 2006.

Miodownik M.A. Grain Boundary Engineering with Particles. Scripta Materialia vol 54, pp 993-997 (2006)

Lorenz C.D., Webb E.B., Stevens M.J., Chandross M., Grest G.SFrictional dynamics of perfluorinated self-assembled monolayers on amorphous SiO2 Tribol Lett. 19 (2): 93-99 , 2005.

Leung K., Rempe S.B., Lorenz C.D.Ion exclusion from silica nanopores Abstr Pap Am Chem Soc. 230: U2957-U2958, 2005.

Chandross M., Lorenz C.A., Grest G.S., Stevens M.J., Webb E.B. Nanotribology of anti-friction coatings in MEMS JOM-US. 57 (9): 55-61, 2005.

Lorenz C.A., Chandross M., Grest G.S., Stevens M.J., Webb E.B.Tribological properties of alkylsilane self-assembled monolayers Langmuir. 21 (25): 11744-11748,2005.

Lorenz C.A., Grest G.S., Chandross M.,Stevens M.J., Webb E.B. Tribological properties of fluorinated self-assembled monolayers Abstr Pap Am Chem Soc. 230: U4328-U4328, 2005.

Basanta D., Miodownik M. A., Holm E. A., and Bentley P. J. Evolving 3D Microstructures from 2D Micrographs using a Genetic Algorithm. Met Trans A. 36A (7): 1643-1652 JUL 2005

Hillman S. R., Mannan S. H., Durairaj R., Seman A., Ekere N. N., Dusek M., Hunt C., Correlation between electrically detected jamming events in solder pastes and skipping defects during printing, Soldering & Surface Mount Technology, 17(4): 17-27, 2005.

Li J. F., Mannan S. H., Clode M. P., Lobato H. M., Liu C., Whalley D. C., Lawrence T., Jackson G., Steen H., Interactions Between Liquid Sn-Bi Based Solders with Contact Metals for High Temperature Applications, Proceedings of the 55th Electronics Components and Technology Conference (ECTC'55), pp. 441-451, Lake Buena Vista, Fl, USA, 31st May 2005, ISSN 0569-5503

Lin F., Godfrey A., Miodownik M. A., and Liu Q. Monte Carlo simulation of cube-texture evolution during grain growth of high-purity nickel. MATER SCI FORUM 475-479: 3149-3152 Part 1-5 2005

Mannan S. H., Clode M. P., Dagher M., Study of intermetallic crystal growth between Nb and molten 52In-48Sn solder, Journal of Electronic Materials, Vol. 34, No.2, pp.125-131, 2005.

Basanta D., Miodownik M.A., Bentley P.J., and Holm E.A.,Investigating the Evolvability of Biologically Inspired CA, Proceedings of GECCO: Genetic and Evolutionary Computation Conference (2005)

Basanta D., Miodownik M.A., Bentley P.J., and Holm E.A.Investigating the Evolvability of a CA-based Embryological ModelProc. Artificial Life 9 (2005).

Mesquida P., Ammann D.L., MacPhee C.E., McKendry R.A., Microarrays of Peptide Fibrils Created by lectrostatically Controlled Deposition. ADVANCED MATERIALS 17 (7): 893+ APR 4 2005.

Miodownik M. A. Facts not Opinions. Nature Materials, Vol 4, July 2005, pp. 506-508.

D R Heine, G S Grest, C D Lorenz, M Tsige, M J Stevens Atomistic simulations of end-linked poly(dimethylsiloxane) networks: Structure and relaxation Macromolecules. 37 (10): 3857-3864, 2004.

C D Lorenz, M J Stevens, R P Wool Fracture behavior of triglyceride-based adhesives J Polym Sci B-Polym Phys. 42 (18): 3333-3343, 2004.

B Park, C D Lorenz, M Chandross, M J Stevens, G S Grest, O A Borodin Frictional dynamics of fluorine-terminated alkanethiol self-assembled monolayers Langmuir. 20 (23): 10007-10014, 2004.

M Tsige, C D Lorenz, M J Stevens Role of network connectivity on the mechanical properties of highly cross-linked polymers Macromolecules. 37 (22): 8466-8472, 2004.

Basanta, D., Miodownik, M. A., Holm, E. A. and Bentley, P. J. (2004) . Investigating the evolvability of Biologicall Inspired CA. Latebreaking paper in Genetic and Evolutionary Computation Conference (GECCO 2004), Seattle, Washington, June 26th-30th, 2004

Basanta D., Miodownik M.A., Bentley P.J., and Holm E.A.Evolving automata to grow patterns, in Evolvability & Interaction: Evolutionary Substrates of Communication, Signaling, and Perception Dynamics of Social Complexity (2004).

Basanta D., Miodownik M. A., Holm E. A., and Bentley P. J. Evolving 3D Microstructures using a Genetic Algorithm. MATER SCI FORUM 467-470: 1019-1024 Part 1-2 2004

Harun A., Miodownik M. A., Clode, M. P. and Holm E. A. Modelling Zener Pinning: A Comparison of Different Computer Simulation Methods. MATER SCI FORUM 467-470: 1033-1038 Part 1-2 2004

Hillman S. R., Mannan S. H., Detection of percolating networks in hard sphere suspensions during shear flow, Proc. of the XIVth Int. Cong. on Rheology, RE25, Seoul, Korea, August 2004. ISBN 89-950057-4-2.

Holm E. A., Miodownik M. A., and Healey, K. A Subgrain Growth Model for Strain-Free Grain Nucleation During Recrystallization. MATER SCI FORUM 467-470: 611-616 Part 1-2 2004

Mannan S. H., Clode M. P., Materials and processes for implementing high temperature liquid interconnects, IEEE Trans. on Adv. Packaging (2004) 27 pp.508-514.

Mannan S. H., Clode M. P., Dissolution of solids in contact with liquid solder, Soldering & Surface Mount Technology (2004) 16 pp.31-33.

Miodownik M.A. The Case For Art Materials Today, Dec 2003, pp. 36-42.

Lorenz C.D., and Stevens M.J.Fracture behavior of Lennard-Jones glasses Phys Rev E. 68 (2) {Part 1}: 021802, 2003.

Basanta D., Bentley P. J., Miodownik M. A., and Holm E. A., Evolving Cellular Automata to Grow Microstructures. In Genetic Programming, Proceedings of the 6th European Conference, EuroGP 2003, Springer, pp 1-10.

Basanta, D., Bentley, P. J., Miodownik, M. A. and Holm, E. A. (2004). Evolving and growing microstructures of materials using biologically inspired CA. LECT NOTES COMPUT SC 2610: 1-10 2003.

Hassold G. N., Holm E. A., and Miodownik M. A. On the accumulation of CSL boundaries during grain growth. (2003) Materials Science and Technology 19 pp.683-687.

Holm. E. A., Miodownik M. A. and Rollett A. On abnormal subgrain growth and the origin of recrystallization nuclei. (2003) Acta Mat. 51 pp.2701-2716.

Miodownik M. A. Using Mechanics to map genotype to phenotype in On Growth and Form, and Computers ed. S. Kumar and P. Bentley - (2003) Elsevier ISBN 0124287654.

Lorenz C.D., Haghgooie R., Kennebrew C., Ziff R.M. The effects of surface defects in a catalysis model Surf Sci. 517 (1-3): 75-86, 2002.

Mesquida P., Stemmer A., Guiding Self-Assembly with the tip of an AFM, Scanning, Vol.24 (2002), pp117-120

Stemmer A., Mesquida P., Naujoks N., Advantages of nanotechnology at the solid-liquid interface, Chimia, Vol.56 , No.10 (2002), p573

Basanta D., Miodownik M. A., Holm E. A., and Bentley P. J. Designing the Internal Architecture of Metals using a Genetic Algorithm. (2002) In Computer-Based Design. Engineering Design Conference 2002, Professional Engineering PublishingLtd, London, UK. pp. 349-355.

Hutt D. A., Liu C., Conway P.P., Whalley D. C., Mannan S. H., Electroless Nickel Bumping of Aluminium Bondpads Part 1: Surface Pre-treatment and Activation, IEEE Transactions on Components and Packaging Technologies (2002) 25Ê pp.87-97.

Hutt D. A., Liu C., Conway P.P., Whalley D. C., Mannan S. H., Electroless Nickel Bumping of Aluminium Bondpads Part 2: Electroless Nickel Plating, IEEE Transactions on Components and Packaging Technologies (2002) 25 pp.98-105.

Knapp H.F., Mesquida P., Stemmer A., Imaging the surface potential of active purple membrane, SURFACE AND INTERFACE ANALYSIS 33 (2): 108-112 FEB 2002.

Mannan, S. H., Solder Paste Reflow Modeling, Soldering and Surface Mount Technology (2002) 14 pp.18-23.

Mesquida P., Stemmer A., Maskless nanofabrication using the electrostatic attachment of gold particles to electrically patterned surfaces. MICROELECTRONIC ENGINEERING 61-2: 671-674 JUL 2002.

Mesquida P., Knapp H.F., Stemmer A., Charge writing on the nanometre scale in a fluorocarbon film, SURFACE AND INTERFACE ANALYSIS 33 (2): 159-162 FEB 2002.

Miodownik M. A. A review of microstructural computer models used to simulate grain growth and recrystallisation in aluminium alloys. (2002) (Invited) Journal of Light Metals 2 pp.125-135.

Lorenz C.D., Ziff R.M. Excess number of percolation clusters on the surface of a sphere Physica A. 296 (1-2): 1-8, 2001.

Lorenz C.D., Ziff R.M. Precise determination of the critical percolation threshold for the three-dimensional "Swiss cheese" model using a growth algorithm J Chem Phys. 114 (8): 2659-3661, 2001.

Hassold G. N., Holm E. A., and Miodownik M. A. On misorientation distribution evolution during anisotropic grain growth.Acta Mat. (2001) 49, pp.2981-2991.

Holm E. A., Miodownik M. A. and Hassold G. N. Dimensional Effects on Anisotropic Grain Growth. (2001) In Proceedings of First Joint International Conference on Recrystallization and Grain Growth, Aachen, Germany, pp. 239-244.

Mannan S. H., Wheeler D., Hutt D. A., Whalley D. C., Conway P. P., Bailey C.,Solder Paste Reflow Modelling for Flip Chip Assembly, TaPtechnology, pp.107-113, Summer 2001.

Mesquida P., Stemmer A., Attaching Silica Nanoparticles from Suspension onto Surface Charge Patterns Generated by a Conductive Atomic Force Microscope Tip. ADVANCED MATERIALS 13 (18): 1395-1398 SEP 14 2001.

Miodownik M. A. and Holm E. A. Computer Simulations of Abnormal Subgrain Growth (2001) In Proceedings of First Joint International Conference on Recrystallization and Grain Growth, Aachen, Germany. pp. 309-314.

Miodownik M. A., Holm E. A. and Hassold G. N. 3D Massively Parallel Cellular Automaton Simulations of Zener Pinning. (2001) In Proceedings of First Joint International Conference on Recrystallization and Grain Growth}, Aachen, Germany. pp. 347-352.

Miodownik M. A., Smereka P., Srolovitz D. J., and Holm. E. A. Scaling of dislocation cell structures: diffusion in orientation space. Proc. Roy. Soc. Lond. A. (2001) 457 pp. 1807-1819.

Miodownik M. A. Grain growth, Uniform. (2001) in Encyclopedia of Materials: Science & Technology, Eds: Buschow et al., Amsterdam, Elsevier, Volume 4, pp 3636-3541.

Miodownik M. A. Zener pinning. (2001) in Encyclopedia of Materials: Science \& Technology, Eds:Buschow et al., Amsterdam, Elsevier, Volume 10, pp 9855-9859.

Tikare V. , Miodownik M. A. and Holm. E. A. Three Dimensional Simulation of Grain Growth in the Presence of Mobile Pores. J. Am. Ceram. Soc. (2001)84 pp. 1379-1385