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Active Implant Silicone Encapsulated Ceramic Enclosure

silicone encapsulated ceramic enclosure
silicone encapsulated ceramic enclosure
silicone encapsulated ceramic enclosure

The device incorporates a hermetically sealed ceramic package which houses the custom printed circuit board configuration. Package integrity is achieved through a solder join between a printed metal layer on the substrate and a metallic coating of the ceramic cap wall. The assembly of the package takes place within a helium environment to allow the hermeticity of the assembled package to be verified through leak rate testing.

silicone encapsulated ceramic enclosure

Printed feedthrough tracks allow the connection of device accessories and connectivity solutions including cables and induction coils outside of the ceramic package. The finished device is encapsulated within a soft silicone elastomer for both protection and biocompatibility.

 

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