Laser Micro-machining
Two micro-machining laser units offer flexibility to execute sophisticated parts in different materials (metals, polymers and ceramic). Working area of 300 x 300 mm2, motion range of ± 100 mm, and equipped with high precision rotary chuck for small tubes (1.27 mm and a wall thickness of 0.15 mm).
Laser Machining Capabilities
MAISI has a fleet of laser machining equipment to enable the processing of metallic, ceramic and polymer components. A comprehensive range of laser powers and sources including diode pumped solid state and Ytterbium doped optical fiber allow for an array of applications including welding, cutting and marking.
Laser Capabilities
Our capabilities extend across the pulse width range from ultrashort pulse femtosecond through to microsecond and millisecond pulse width providing flexibility of processing depths and heat affected zones (HAZ).