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Titanium Ceramic Micro Enclosure Device

titanium ceramic micro enclosure top
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titanium ceramic micro enclosure

The device incorporates a hermetically sealed Titanium - Ceramic package which houses the custom printed circuit board configuration. Verified cleaning & drying procedures ensure minimal contamination and moisture presence on the components prior to package sealing. Package integrity is achieved through a diffusion bond join between the Titanium and Ceramic tube sections and a welded join between the Titanium tube section and Titanium feedthrough housing

titanium ceramic micro enclosure

Metal in glass feedthrough pins allow the connection of device accessories and connectivity solutions including cables and induction coils outside of the Titanium - Ceramic package. The connections are encapsulated within epoxy resin for both protection and biocompatibility.

 

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